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Title:
封着材料
Document Type and Number:
Japanese Patent JP5413562
Kind Code:
B2
Abstract:

To provide a sealing material comprising bismuth-based glass powder and refractory filler powder in which, while maintaining the thermal stability of the bismuth-based glass powder, the content of Bi2O3in the bismuth-based glass powder is made high, and further, the shape of the refractory filler powder is improved, thus the fluidity of the sealing material is improved, and the characteristics of a ceramic package or the like are improved.

The sealing material comprising bismuth-based glass powder and refractory filler powder is characterized in that: (1) the bismuth-based glass powder comprises, as a glass composition, by mass% expressed in terms of the below oxide, 76 to 90% Bi2O3, 2 to 12% B2O3, 1 to 20% ZnO and 0.01 to 10% CuO; (2) the content of the bismuth-based glass powder is 35 to 95 vol.%, and the content of the refractory filler powder is 5 to 65 vol%; and (3) the refractory filler powder has an almost spherical shape.

COPYRIGHT: (C)2009,JPO&INPIT


Inventors:
Kunihiko Kano
Application Number:
JP2008307919A
Publication Date:
February 12, 2014
Filing Date:
December 02, 2008
Export Citation:
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Assignee:
Nippon Electric Glass Co., Ltd.
International Classes:
C03C8/24; B82Y20/00; B82Y30/00; B82Y99/00; H01J9/26; H01J11/46; H01J11/48; H01L23/29; H01L23/31; H01L51/50; H05B33/04
Domestic Patent References:
JP2006137637A
JP3075239A
JP3075240A
JP2004296572A
JP2002348152A
JP4275944A



 
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