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Title:
SEALING MECHANISM FOR ROTARY SHAFT AND LIQUID PROCESSOR
Document Type and Number:
Japanese Patent JP2004003602
Kind Code:
A
Abstract:

To provide a sealing mechanism for a rotary shaft in which a sealing performance between the rotary shaft and a sealing ring is enhanced, and a liquid processor provided with the sealing mechanism for the rotary shaft.

The cleaning processor 1 has a rotor 34 to hold a wafer W, an outside chamber 71a and an inside chamber 71b capable of storing the rotor 34, a spindle 50 to rotate the rotor 34, and an outer tube member 32 provided around the spindle 50. A first sealing ring 13 made of a resin or the like is mounted to a ring member 12 constituting the outer tube member 32. A clearance between the spindle 50 and the first sealing ring 13 or the like is adjusted by friction and abrasion of the first sealing ring 13 or the like by rotating the spindle 50 for a prescribed period of time after press-fitting the first sealing ring 13 or the like to the spindle 50.


Inventors:
EGASHIRA KOJI
KAMIKAWA YUJI
TAIRA MAKI
Application Number:
JP2003022590A
Publication Date:
January 08, 2004
Filing Date:
January 30, 2003
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
B08B3/02; B05C11/08; F16J15/16; F16J15/18; F16J15/40; H01L21/00; H01L21/304; (IPC1-7): F16J15/18; B05C11/08; B08B3/02; H01L21/304
Attorney, Agent or Firm:
Hiroshi Takayama