Title:
SEALING MEMBER, CVD APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2005286259
Kind Code:
A
Abstract:
To provide a sealing member having improved durability, a CVD apparatus using the same, and a method of manufacturing a semiconductor device using the CVD apparatus.
In the case that the planar shape of a sealing groove is square annular for example, a sealing member 10 having a square annular planar shape based on the shape of the sealing groove and a square cross section with rounded corners is formed. By adopting such a sealing member 10 to a CVD apparatus which includes a slot valve with a square annular sealing groove, manufacturing efficiency and an yield are improved.
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Inventors:
MIYAMOTO YUUKI
Application Number:
JP2004101721A
Publication Date:
October 13, 2005
Filing Date:
March 31, 2004
Export Citation:
Assignee:
RENESAS TECH CORP
International Classes:
F16J15/10; C23C16/44; H01L21/31; (IPC1-7): H01L21/31; C23C16/44; F16J15/10
Attorney, Agent or Firm:
Yamato Tsutsui
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