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Patent Searching and Data


Title:
SEALING METHOD FOR PACKAGING
Document Type and Number:
Japanese Patent JPS5526610
Kind Code:
A
Abstract:

PURPOSE: To provide parallel seam welding for sealing a case of relatively large dimensions with a relatively small power source by providing a good conductor layer on or contacting a good conductive surface with the lid of the case.

CONSTITUTION: A surface of a lid 4 excluding areas in contact with welding electrodes 5, 6 is covered and contacted with a gold or other metal plated surface or a pasty conductor layer. Alomst no electric energy is consumed at the thus covered areas which situate very low, but mostly at the areas where the lid is contacted with the welding electrodes. Thus, without consumption of excessive energy, but with a relatively small source of energy, sealing by means of parallel seam welding techniques can be applied to a case of relatively large dimensions.


Inventors:
SHIBATA SUSUMU
KIMURA MASARU
Application Number:
JP9844778A
Publication Date:
February 26, 1980
Filing Date:
August 12, 1978
Export Citation:
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Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
H01L23/02; B23K11/06; B23K11/08; (IPC1-7): B23K11/08; H01L23/02