Title:
SEALING METHOD FOR RESIN AND MOLD THEREFOR
Document Type and Number:
Japanese Patent JPH0645383
Kind Code:
A
Abstract:
PURPOSE: To eliminate sealing of resin with inclination of a semiconductor chip and exposure of leads, a placing part and metal wirings which must be originally covered with resin due to flow of the resin to be poured.
CONSTITUTION: A method for sealing a semiconductor device with resin and a mold therefor comprise pins 16 for supporting a placing part of a lead frame 2 of a sealed semiconductor chip 1. The pins 16 are retreated before resin is poured in a cavity 15 and started to be cured (crosslinked), and moved to a position where its end coincides with a surface of the cavity 15. Thus, an inclination of the chip due to flow of the resin and exposure of components from the resin due to the inclination are prevented.
Inventors:
SAITO TAKEHIRO
Application Number:
JP19933092A
Publication Date:
February 18, 1994
Filing Date:
July 27, 1992
Export Citation:
Assignee:
NEC CORP
International Classes:
B29C45/02; B29C45/26; H01L21/56; B29L31/34; (IPC1-7): H01L21/56; B29C45/02; B29C45/26
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)