Title:
SEALING METHOD FOR SEMICONDUCTOR ELEMENT WITH RESIN
Document Type and Number:
Japanese Patent JPS57167640
Kind Code:
A
Abstract:
PURPOSE:To increase pressure in the cavity of a die by stages, and to prevent the generation of burr by detecting the position of the plunger of a cylinder for pushing the resin and augmenting the push-down force of the plunger after the plunger reaches a predetermined position. CONSTITUTION:An oil liquid discharged from a pump 24 is forwarded to the cylinder 28 through a check valve 25, a changeover valve 22 and flow-rate control valves 26, 27, and downward pushed the plunger 29. The resin in a pot 31b is sent to the cavity 31a of the die 31 by pressure through the fall of the plunger 29. The position of the plunger 29 is detected by means of a positional sensor 29', and detecting signals are compared with set value by means of a comparator 32. When the position of the plunger 29 reaches the set value, signals are transmitted to a pressure control valve 35 from a controller 34, the push-down force of the plunger 29 is increased, and pressure in the cavity 31a is augmented by stages.
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Inventors:
SERA MICHITOSHI
KODAMA MASAHIRO
KODAMA MASAHIRO
Application Number:
JP5169381A
Publication Date:
October 15, 1982
Filing Date:
April 08, 1981
Export Citation:
Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
B29C45/00; B29B7/00; B29C39/00; B29C39/10; B29C39/28; B29C39/40; B29C39/42; B29C39/44; B29C43/00; B29C45/02; B29C45/14; B29C45/76; B29C45/77; H01L21/56; (IPC1-7): B29C6/02; B29G3/00