Title:
SEALING RESIN COMPOSITION, BONDED STRUCTURE CONTAINING IT, AND METHOD FOR SEALING ELECTRONIC PARTS
Document Type and Number:
Japanese Patent JP2007131820
Kind Code:
A
Abstract:
To provide a resin composition which is easily peelable from a substrate when electronic parts are detached from the substrate.
The sealing resin composition, containing a curable resin and a foaming agent, is characterized in that the curable resin is curable at a temperature lower than the gas-evolving temperature of the foaming agent, and the foaming agent amounts to 0.01-30% by weight relative to the sum total of the curable resin and the foaming agent.
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Inventors:
MATSUNO KOSO
MIYAGAWA HIDEKI
YAMAGUCHI ATSUSHI
HIGUCHI TAKAYUKI
TSUJIMURA HIDEYUKI
MIYAGAWA HIDEKI
YAMAGUCHI ATSUSHI
HIGUCHI TAKAYUKI
TSUJIMURA HIDEYUKI
Application Number:
JP2005328850A
Publication Date:
May 31, 2007
Filing Date:
November 14, 2005
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
C08L101/00; C08K5/00; C09K3/10; H01L21/60; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Kazuo Ishii
Shinichi Kawasaki
Shinichi Kawasaki