Title:
SEALING RESIN COMPOSITION AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2020132771
Kind Code:
A
Abstract:
To provide a sealing resin composition, that has a good sealing property at the time of laser irradiation without using carbon black, which may cause a short circuit or a decrease in insulation reliability, and that can yield a sealed product having a color tone similar to that of the conventional sealing resin composition.SOLUTION: A sealing resin composition, containing an epoxy resin (A), a curing agent (B), an inorganic filler (C), a dye (D), and a substance (E) whose color tone changes with laser beam, and in which the contained amount of carbon black in all components is less than 0.01 mass%; and an electronic device in which electronic parts are sealed with a cured product of said sealing resin composition.SELECTED DRAWING: Figure 1
Inventors:
KOBAYASHI TETSUO
TAKADA WATARU
TAKADA WATARU
Application Number:
JP2019029230A
Publication Date:
August 31, 2020
Filing Date:
February 21, 2019
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08L63/00; C08K3/013; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Shinji Hayami