To provide an electronic component sealing resin composition excellent in insulation properties as well as light shielding properties and capable of being produced at a low cost and to provide a resin-sealed electronic component device using the resin composition.

The sealing resin composition essentially consists of (A) an epoxy resin, (B) a phenolic resin, (C) a first black colorant having at least one colorant selected from aniline black and an anthraquinone black organic colorant, and (D) an inorganic filler and, when cured, can give an electronic component excellent in light shielding properties, insulation properties, and resistance to constituent flow . The resin-sealed electronic component device is produced by using the resin composition.