Title:
SEALING RESIN COMPOSITION AND SEALED SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH04248831
Kind Code:
A
Abstract:
PURPOSE:To obtain a sealing resin composition, containing a specific epoxy resin, a polyfunctional phenolic resin, silica powder and a prescribed amount of a tris(ortho-para-substituted phenyl)phosphine as a curing accelerator and excellent in moldability. CONSTITUTION:A sealing resin composition excellent in moisture resistance and solder heat resistance after dipping in solders or solder reflow is obtained by including (A) an epoxy resin expressed by formula I [(n) is >=0], (B) a polyfunctional phenolic resin such as tri- or tetrafunctional phenolic resin expressed by formula II or III {R is CmH2m+1 [(m) is >=0], (C) a tris(ortho.parasubstituted phenyl)phosphine expressed by formula IV (R<1>, R<4> and R<3> are electron donative group such as alkoxy, ammno or alkyl or H) as a curing accelerator and (D) silica powder as a filler as essential components. The amount of the aforementioned component (C) is 0.01-5wt.% based on the resin composition.
Inventors:
KOKUBO MASANORI
SAWAI KAZUHIRO
NISHIKAWA GOJI
SAWAI KAZUHIRO
NISHIKAWA GOJI
Application Number:
JP2565991A
Publication Date:
September 04, 1992
Filing Date:
January 25, 1991
Export Citation:
Assignee:
TOSHIBA CHEM CORP
International Classes:
C08G59/24; C08G59/00; C08G59/20; C08G59/40; C08K3/36; C08K5/50; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08G59/24; C08G59/40; C08K3/36; C08K5/50; C08L63/00; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Eiji Morota
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