Title:
SEALING RESIN COMPOSITION, SHEET MATERIAL, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2023157335
Kind Code:
A
Abstract:
To provide a sealing resin composition less likely to create cavities in a sealing material when manufacturing the sealing material for sealing the gap between the base material and the semiconductor chip by using a sheet material manufactured from the sealing resin composition.SOLUTION: A sealing resin composition contains: a polyphenylene ether resin (A) that has a substituent that has radical polymerizability; tiallylisocyanurate (B); an inorganic filler (C); a radical polymerization initiator (D); and a thermoplastic elastomer (E). The percentage of the triallyl isocyanurate (B) is 5% by mass or more and 20% by mass or less based on the solid content of the sealing resin composition. The percentage of the thermoplastic elastomer (E) is 5% by mass or more and 18% by mass or less based on the solid content of the sealing resin composition.SELECTED DRAWING: Figure 1
Inventors:
MIZUTANI JUN
TANAKA KAZUNARI
AKASHI TAKAHIRO
TANAKA KAZUNARI
AKASHI TAKAHIRO
Application Number:
JP2022067184A
Publication Date:
October 26, 2023
Filing Date:
April 14, 2022
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
H01L23/29; C09J7/30; C09J11/04; C09J11/06; C09J11/08; C09J171/12
Attorney, Agent or Firm:
Hokuto Patent Attorneys Office
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