Title:
SEALING STRUCTURE AND SEALING METHOD
Document Type and Number:
Japanese Patent JP3538683
Kind Code:
B2
Abstract:
PURPOSE: To provide sufficient sealing property by using a composite or a mixed material of glass with other materials as a sealing material.
CONSTITUTION: A sealing structure is composed of a cap 10 made of a metal, a pin 15 made of a metal, and a sealing material 20. The thermal expansion coefficient of the cap 10 is higher than that of the sealing material 20 and the outer diameter B1 of the sealing material 20 is larger than the inner diameter A of the cap 10. The thermal expansion coefficient of the pin 15 is smaller than that of the sealing material 20 and the diameter C of the pin is larger than the inner diameter B2 of the sealing material 20. The sealing material 20 is a material prepared by coating the whole surface of a dielectric material 21 with glass. The sealing material 20 is set at the periphery of the open part of the cap 10 and at the same time the pin is set at a hole 23 of the sealing material 20 and forces F1, F2 are applied to the sealing material 20 and the pin 15 from outside while they are heated at high temperature.
Inventors:
Sugimoto, Yasutaka
Takagi, Hiroshi
Takagi, Hiroshi
Application Number:
JP153193A
Publication Date:
June 14, 2004
Filing Date:
January 08, 1993
Export Citation:
Assignee:
MURATA MFG CO LTD
International Classes:
H01B17/58; H02G3/08; H05K5/06; (IPC1-7): H01B17/58; H02G3/08; H05K5/06
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