Title:
SEALING STRUCTURE
Document Type and Number:
Japanese Patent JP3146222
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To make it possible to ensure sufficient sealability even if the sealing section of a seal becomes hot and manufacture the seal at low cost without using a firing process.
SOLUTION: This sealing structure is for a signal wire lead-out area that penetrate a wall and transmits information between the inside and outside of the wall. In this sealing structure, a signal wire S contains a core material 1; an inorganic powder portion 3 placed around the core material 1; and a ductile metal tube 2 placed around the inorganic powder portion 3. The signal wire S is passed through a hole drilled in a wall. The signal wire S has restricted portions Sn formed at least in areas at specified depths from one side of the wall; the restricted portions are formed by the plastic flow inside the wall that is caused by compressing the periphery of the hole in the direction of the thickness of the wall.
Inventors:
Kiyoshi Tanaka
Ken Ichiyanagi
Nobuyuki Tobita
Morio Tamura
Fujio Sato
Akira Tokairin
Hideo Seki
Munehiko Kuwa
Ken Ichiyanagi
Nobuyuki Tobita
Morio Tamura
Fujio Sato
Akira Tokairin
Hideo Seki
Munehiko Kuwa
Application Number:
JP30767895A
Publication Date:
March 12, 2001
Filing Date:
November 27, 1995
Export Citation:
Assignee:
Okazaki Manufacturing Co., Ltd.
Placerum Co., Ltd.
Placerum Co., Ltd.
International Classes:
F16L5/02; F16J15/06; H02G3/22; (IPC1-7): H02G3/22; F16J15/06; F16L5/02
Domestic Patent References:
| JP60180412A | ||||
| JP2307316A | ||||
| JP779517A | ||||
| JP274686U | ||||
| JP274687U |
Attorney, Agent or Firm:
Fuyuki Nagai