Title:
シーム溶接装置
Document Type and Number:
Japanese Patent JP3579086
Kind Code:
B2
Inventors:
Noriaki Tsunoda
Application Number:
JP14646194A
Publication Date:
October 20, 2004
Filing Date:
June 28, 1994
Export Citation:
Assignee:
Seiwa Manufacturing Co., Ltd.
International Classes:
B23K11/06; B23K11/30; (IPC1-7): B23K11/06; B23K11/30
Domestic Patent References:
| JP2092470A | ||||
| JP4228275A | ||||
| JP58032588A |
Attorney, Agent or Firm:
Takehiro Chiba
Tatsuhiko Sato
Tatsuhiko Sato