Title:
SELECTEIVE ETCHING METHOD
Document Type and Number:
Japanese Patent JPS5213779
Kind Code:
A
Abstract:
PURPOSE:In order to completely remove pin holes which generate on photo-sensitive resins, through placing a porous mask to be used for the contact with symmetry thereby rotating the mask and painting the photo-sensitive resins twice and exposing and developing.
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Inventors:
KIYO HIDEO
SHIBATA SHIYUUSAKU
SAKAI HIROSHI
OOTSUKI OSAMU
SHIBATA SHIYUUSAKU
SAKAI HIROSHI
OOTSUKI OSAMU
Application Number:
JP8985475A
Publication Date:
February 02, 1977
Filing Date:
July 22, 1975
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
G03F7/20; H01L21/027; H01L21/302; (IPC1-7): H01L21/302
Domestic Patent References:
| JPS4852479A | 1973-07-23 |