To provide a selection method of an individual packing material for individually packing a semiconductor single crystal wafer capable of efficiently selecting the individual packing material which can reduce influence on a surface condition of the semiconductor single crystal wafer, especially surface contamination amount of the semiconductor single crystal wafer in a short time to prevent characteristic abnormality of the semiconductor single crystal wafer when stored for a long period of time, and a management method and an inspection method of the individual packing material.

A selection method of an individual packing material for individually packing a semiconductor single crystal wafer is capable of selecting in a short time the individual packing material which can be applied to a long-term storage in actual use by conducting an acceleration testing under a heat stress at a temperature higher than a storage condition in the actual use by using the individual packing material which houses the semiconductor single crystal wafer, and obtaining a corresponding relationship of information on a surface condition of the semiconductor single crystal wafer between a case when the material is stored for a long time in the actual use and a case when the material is stored for a short time in the acceleration testing.