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Title:
SEMI-AROMATIC POLYAMIDE RESIN
Document Type and Number:
Japanese Patent JP2013040346
Kind Code:
A
Abstract:

To provide a semi-aromatic polyamide resin which has a high level of residence stability, hot-water resistance and chemical resistance and is also excellent in adhesive properties to and compatibility with other resins and the like.

The semi-aromatic polyamide resin comprises: dicarboxylic acid units in which 50 to 100 mol% of the dicarboxylic acid units are aromatic dicarboxylic acid units; and diamine units in which 60 to 100 mol% of the diamine units are aliphatic diamine units having 9 to 13 carbon atoms. Furthermore, at least 10% of terminal groups of molecular chains of the polyamide resin are blocked with a terminal-blocking agent, and the amount of terminal amino groups of the molecular chains is 60 μeq/g or more and 120 μeq/g or less. In addition, [NH2]/[COOH] ≥6 is satisfied, where [NH2] (μeq/g) represents the amount of the terminal amino groups and [COOH] (μeq/g) represents the amount of terminal carboxyl groups.


Inventors:
UCHIDA KOICHI
KIKUCHI HIROBUMI
KASHIWAMURA TSUGIFUMI
YAMASHITA TAKASHI
YAMAZAKI YOKI
Application Number:
JP2012238146A
Publication Date:
February 28, 2013
Filing Date:
October 29, 2012
Export Citation:
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Assignee:
KURARAY CO
International Classes:
C08G69/26; C08K7/20; C08L77/06; C08L101/06; F16L9/12
Domestic Patent References:
JPH111555A1999-01-06
JPH02113026A1990-04-25
JPH10162653A1998-06-19
JP2002114906A2002-04-16
JP2004150500A2004-05-27
JP2002370551A2002-12-24
JP2002338803A2002-11-27
Foreign References:
WO2006098434A12006-09-21
Attorney, Agent or Firm:
Taji U.S. Patent Office