Title:
セミリジッドケーブル組立体、セミリジッドケーブル搭載基板及びセミリジッドケーブル搭載基板の製造方法
Document Type and Number:
Japanese Patent JP7430577
Kind Code:
B2
Abstract:
To solder a semi-rigid cable to the prescribed position of a substrate by preventing heat deformation in a flexure-processed part of the semi-rigid cable in soldering of the semi-rigid cable to the substrate.SOLUTION: A semi-rigid cable assembly 3U comprises: a semi-rigid cable 1U flexure-processed in a single plane face; and a heat deformation-preventing member 2U that has holding members 22U, 23U holding both end vicinities of a flexure-processed portion 11U in the semi-rigid cable 1U; and a fixing member 24U fixing the physical relationship of the holding members 22U, 23U, and that prevents a heat deformation of the flexure-processed portion 11U in the semi-rigid cable 1U when soldering the cable 1U.SELECTED DRAWING: Figure 2
Inventors:
Toru Shibanuma
Yutaka Yamamoto
Takeshi Kaneko
Yutaka Yamamoto
Takeshi Kaneko
Application Number:
JP2020090961A
Publication Date:
February 13, 2024
Filing Date:
May 25, 2020
Export Citation:
Assignee:
Japan Radio Co., Ltd.
International Classes:
H01B11/18; B23K3/00; H05K13/00
Domestic Patent References:
| JP11330809A | ||||
| JP3217312U |
Attorney, Agent or Firm:
Kenji Okada
Masaaki Hata
Mari Tanaka
Katsuhiro Imashita
Masaaki Hata
Mari Tanaka
Katsuhiro Imashita