Title:
SEMICONDUCTIVE SHEET AND SHEET WATERPROOF STRUCTURE
Document Type and Number:
Japanese Patent JP2005146775
Kind Code:
A
Abstract:
To carry out a highly reliable pinhole inspection over a long period of time by protecting a semiconductive layer from moisture, chemicals, rubbing, or the like in a semiconductive sheet laid on the lower face side of a waterproof sheet in constructing a sheet waterproof structure by an insulating construction method.
The semiconductive sheet 1 disposed between a building skeleton and the waterproof sheet made of thermoplastic resin and laid on the surface side of the building skeleton, is constituted by providing the semiconductive layer 12 with a surface resistivity of 0.1-10E+9Ω in conformity to JISK6911 or JISK7194, on a base material layer 11, and providing an insulating layer 13 further thereon to integrate them by lamination.
Inventors:
NAKAJIMA SEIKO
Application Number:
JP2003389417A
Publication Date:
June 09, 2005
Filing Date:
November 19, 2003
Export Citation:
Assignee:
TSUTSUNAKA SHEET BOSUI KK
International Classes:
E04B1/66; B32B7/02; E04D5/00; E04D11/00; (IPC1-7): E04D5/00; B32B7/02; E04B1/66; E04D11/00
Attorney, Agent or Firm:
Hisayoshi Shimizu
Ken Takada
Kurose Yasuhisa
Yoshihito Shimizu
Toshiya Kido
Ken Takada
Kurose Yasuhisa
Yoshihito Shimizu
Toshiya Kido