To provide a semiconductor acceleration sensor capable of measuring a temperature characteristic without mounting the semiconductor acceleration sensor in a package, and thereby simplifying a manufacturing process, and its inspection method.

This semiconductor acceleration sensor 1 is equipped with a frame part 11 comprising a semiconductor substrate and having a frame shape; an elastic beam part 12 projecting from the frame part 11 to the inside; a weight part 13 supported by the beam part 12 and displaced rockably; and a piezo resistance 14 provided on the surface layer of the beam part 12, for outputting a signal corresponding to the magnitude of an applied acceleration. The sensor 1 is provided with a heater 15 for heating the piezo resistance 14 on the beam part 14 or at least on either of the frame part 11 and the weight part 13 on a position connected to the beam part 14.