Title:
半導体ボンディングワイヤーのスプール収納ケース
Document Type and Number:
Japanese Patent JP4124559
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an improved spool storage case which is used for storage or transportation of a spool with wound semiconductor bonding wire. SOLUTION: In a spool storage case of a semiconductor bonding wire consisting of a casing main body A with a cover fitting bank having a hollow on the reverse and a cover case B capable of fitting in the outer surface of the cover fitting bank of this casing main body A, a trench 41 on the reverse side of the cover fitting bank 31 provided with the casing main body A has a space where a thumb can be put in at least.
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Inventors:
Yuichi Miyahara
Application Number:
JP2000325517A
Publication Date:
July 23, 2008
Filing Date:
October 25, 2000
Export Citation:
Assignee:
Tanaka Electronics Co., Ltd.
International Classes:
B65D85/00; H01L21/60; B65H49/38; B65H75/14
Domestic Patent References:
| JP11067814A | ||||
| JP2000049188A | ||||
| JP7086326A | ||||
| JP1083769U |
Attorney, Agent or Firm:
Kazuo Tomita
Kutaro Kamoi
Kageyama Shuichi
Kutaro Kamoi
Kageyama Shuichi