Title:
半導体チップ製造装置および半導体チップ製造方法
Document Type and Number:
Japanese Patent JP7034371
Kind Code:
B2
Abstract:
In a semiconductor chip manufacturing device which produces a plurality of LD chips by dividing a semiconductor wafer, being placed in a casing in which a fluid medium is filled, on which a block line is formed in advance and also on which a scribed line is inscribed so that a microcrack is formed along the scribed line, the semiconductor chip manufacturing device comprises a reception stage for supporting the semiconductor wafer, and a blade cutting-edge for pressurizing the semiconductor wafer along its crack portion made of the block line or the scribed line, so that the semiconductor wafer is divided into a plurality of LD chips by pressurizing it by means of the blade cutting-edge along the crack portion in the fluid medium.
Inventors:
Tetsuya Uetsuji
Ayumu Fuchida
Suzuki Masato
Ayumu Fuchida
Suzuki Masato
Application Number:
JP2021503370A
Publication Date:
March 11, 2022
Filing Date:
March 07, 2019
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L21/301; B28D5/00; B28D7/02
Domestic Patent References:
| JP5102302A | ||||
| JP2015226018A | ||||
| JP4180651A |
Attorney, Agent or Firm:
Patent Business Corporation Parumo Patent Office