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Title:
SEMICONDUCTOR COMPOSITE DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR COMPOSITE DEVICE, LED HEAD USING SEMICONDUCTOR COMPOSITE DEVICE AND IMAGE FORMING APPARATUS USING LED HEAD
Document Type and Number:
Japanese Patent JP2006140186
Kind Code:
A
Abstract:

To provide a semiconductor junction state in which even if excess flattening and surface treatment are not performed, processing and bonding process on the front surface of bonding are easy and which obtains good bonding strength and bonding strength distribution.

A semiconductor composite device having a semiconductor thin film layer 104 and a substrate 101 so that a semiconductor thin film layer 105 and the substrate 101 are bonded mutually through a high melting point metal 103, and an alloy layer 121 of a high melting point metal 103 and a low melting point metal 104 and the alloy 121 has a higher melting point than the low melting point metal 104. The low melting point metal is selected from the group consisting of In, Sn, Bi, Ce and Tl. The high melting point metal is selected from the group consisting of Au, Pd and Ni.


Inventors:
OGIWARA MITSUHIKO
FUJIWARA HIROYUKI
SUZUKI TAKAHITO
SAKUTA MASAAKI
ABIKO ICHIMATSU
Application Number:
JP2004326123A
Publication Date:
June 01, 2006
Filing Date:
November 10, 2004
Export Citation:
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Assignee:
OKI DATA KK
OKI DIGITAL IMAGING KK
International Classes:
H01L33/30; H01L33/36; H01L33/62
Domestic Patent References:
JP2004172351A2004-06-17
JP2004235509A2004-08-19
JP2004056109A2004-02-19
JP2005516415A2005-06-02
Foreign References:
WO2003065420A22003-08-07
WO2003065464A12003-08-07
US6335263B12002-01-01
Attorney, Agent or Firm:
Minoru Maeda
Youichi Yamagata



 
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