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Title:
SEMICONDUCTOR DEVICE ADHESIVE TAPE
Document Type and Number:
Japanese Patent JP3774419
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a semiconductor device adhesive tape which is superior in wire-bonding properties and reflow resistance and which does not have the problem of interlayer peeling or the like.
SOLUTION: In the semiconductor device adhesive tape, a thermosetting adhesive layer is laminated on at least one face of an insulating film. It is desirable that a loss modulus at 200°C in the thermosetting adhesive layer after thermosetting is not less than 5 MPa, and a storage modulus is not less than 20 MPa. The thermosetting adhesive layer comprises a polyamide resin, and the polyamide resin is obtained from an unsaturated fatty acid dimer whose number of carbons is 36.


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Inventors:
Shoji Aoki
Takushi Shiozawa
Toshio Fujii
Hiromi Yamada
Application Number:
JP2002097080A
Publication Date:
May 17, 2006
Filing Date:
March 29, 2002
Export Citation:
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Assignee:
Tomagawa Paper Mill Co., Ltd.
International Classes:
C08G69/26; H01L21/52; C09J7/02; C09J177/06; C09J201/00; H01L21/60; H01L23/12; (IPC1-7): H01L21/52; C08G69/26; C09J7/02; C09J177/06; C09J201/00; H01L21/60; H01L23/12
Domestic Patent References:
JP2001284412A
JP11241056A
JP2002118144A



 
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