Title:
SEMICONDUCTOR DEVICE ASSEMBLING JIG
Document Type and Number:
Japanese Patent JPS53129969
Kind Code:
A
Abstract:
PURPOSE:To prevent damaging of pellets at the time of removing jig after reflowsoldering of the pellets by using a semparation jig composed of a reference piece and a locating piece.
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Inventors:
OKAMURA SHINAYA
OOHASHI YOSHIO
OOHASHI YOSHIO
Application Number:
JP4447077A
Publication Date:
November 13, 1978
Filing Date:
April 20, 1977
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/68; H01L21/52; H01L21/58; H01L23/04; (IPC1-7): H01L21/58; H01L21/68; H01L23/04