SEMICONDUCTOR DEVICE FOR ELECTRIC POWER - MITSUBISHI ELECTRIC CORP

Title:

SEMICONDUCTOR DEVICE FOR ELECTRIC POWER

Document Type and Number:

Japanese Patent JP2005005416

Kind Code:

A

Abstract:

To provide a semiconductor device for electric power wherein resin lifting prevention and the improvement of a wire bonding property are obtained and miniaturization is achieved.

A main terminal lead (2) is a single member wherein an inner lead (2a) to which bonding wires (3) are fixed and an outer lead (2b) for external connection are collectively formed in an integral body. The outer lead is exposed to the outside from molded resin (4). A plurality of the bonding wires are fixed in parallel to a plurality of wire fixing parts (3b) on the inner lead. Corresponding to the wire fixing parts (3b) formed on the inner lead (2a), a plurality of penetrating holes (8) which penetrate the main terminal lead are formed almost in parallel to the arrangement direction of the wire fixing parts (3b) at external side neighboring positions of the wire fixing parts (3b).

Inventors:

KIKUCHI MASAO
NAKAJIMA YASUSHI
TSURUSAKO KOICHI
YOSHIHARA KUNIHIRO

Application Number:

JP2003166058A

Publication Date:

January 06, 2005

Filing Date:

June 11, 2003

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP

International Classes:

H01L21/60; H01L21/607; H01L23/495; H01L23/28; H01L23/50; H01L25/04; (IPC1-7): H01L23/50; H01L21/60; H01L23/28

Attorney, Agent or Firm:

Osamu Kawamiya
Masahiro Ishino

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