PURPOSE: To contrive a stabilized lead positioning by a method wherein a recess is provided to encircle a mount for a semiconductor element on a ceramic base and said recess accommodates the bent end of a lead.

CONSTITUTION: A mount 5 for a semiconductor element is provided on the surface of a ceramic base 1 and the mount 5 is encircled with a recess 7. A lead frame 4 is fixed by low melting point glass 2 and 3 to the ceramic base 1 and the bent end thereof is buried in the recess 7. By burying the bent end of the lead 6 first, positioning of the lead frame 4 on the ceramic base 1 for fixa tion is carried out with ease, the recess 7 acting as a guide. This eliminates lead dislocation to be caused by the glass having low melting point, thereby ensuring a reliable wire bonding.