Title:
SEMICONDUCTOR DEVICE HAVING AIR ISOLATION STRUCTURE
Document Type and Number:
Japanese Patent JP2004063749
Kind Code:
A
Abstract:
To provide a semiconductor device having a complete air isolation structure where impurities do not exist between wirings of a semiconductor element.
In the semiconductor device, the sacrificial polymer whose heat resistant temperature is not less than 250°C and thermal decomposition temperature is not more than 500°C has the air isolation structure obtained by removing the sacrificial polymer from an air isolation structure precursor arranged between the metallic wirings.
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Inventors:
HANABATAKE HIROYUKI
KUROKI MASAKATSU
KUROKI MASAKATSU
Application Number:
JP2002219624A
Publication Date:
February 26, 2004
Filing Date:
July 29, 2002
Export Citation:
Assignee:
ASAHI KASEI CORP
International Classes:
C08F8/04; C08F32/06; H01L21/768; H01L23/522; (IPC1-7): H01L21/768; C08F8/04; C08F32/06
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