Title:
SEMICONDUCTOR DEVICE, IMAGING SEMICONDUCTOR DEVICE, AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP3695583
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a packaged semiconductor device with a thinner thickness and a smaller area than those of a conventional device and to provide its manufacturing method.
SOLUTION: A wire pattern 12a is molded in a resin housing 14A with an imaging lens 3 fitted thereto. A part of the wire pattern 12a is exposed on a bottom side of the resin housing 14A. While an electric part 9 is molded in the resin housing 14A, the electronic part 9 is connected to the wire pattern 12a. A solid-state imaging element chip 10A is flip-chip-mounted to the wire pattern 12a exposed from the resin housing 14A.
Inventors:
Toshiyuki Honda
Kazuto Tsuji
Masanori Onodera
Moriya Shin
Izumi Kobayashi
Hiroshi Aoki
Kazuto Tsuji
Masanori Onodera
Moriya Shin
Izumi Kobayashi
Hiroshi Aoki
Application Number:
JP2002044322A
Publication Date:
September 14, 2005
Filing Date:
February 21, 2002
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L27/14; H01L23/02; H01L31/02; H04N5/225; H04N5/335; H05K1/00; H05K3/20; H05K3/40; (IPC1-7): H04N5/335; H01L27/14; H04N5/225
Domestic Patent References:
| JP11191865A | ||||
| JP2001008068A | ||||
| JP2000049319A | ||||
| JP2001267540A | ||||
| JP2001332654A |
Foreign References:
| WO1995026047A1 |
Attorney, Agent or Firm:
Tadahiko Ito
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