Title:
Semiconductor device and its fabricating method
Document Type and Number:
Japanese Patent JP5983201
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device by preventing an adhesive from flowing into an interface between a semiconductor element and a cover member.SOLUTION: A semiconductor device comprises: a substrate mounted with a semiconductor element on a surface thereof; an adhesive arranged around a region in which the semiconductor element is mounted on the surface of the substrate and including an extention part extending along a side of the semiconductor element; and a cover member including a first surface arranged to cover the semiconductor element and in contact with the adhesive, and a protrusion provided at a position corresponding to a tip part of the extension part on the first surface.
Inventors:
Takumi Ihara
Atsuwa Shimizu
Atsuwa Shimizu
Application Number:
JP2012193337A
Publication Date:
August 31, 2016
Filing Date:
September 03, 2012
Export Citation:
Assignee:
Socionext Inc.
International Classes:
H01L23/12; H01L23/34
Domestic Patent References:
| JP2012009476A | ||||
| JP59040552A | ||||
| JP2005353956A | ||||
| JP7202064A |
Attorney, Agent or Firm:
Furuya Fumio
Toshihide Mori
Toshihide Mori
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