Title:
Semiconductor device and its fabricating method
Document Type and Number:
Japanese Patent JP6228490
Kind Code:
B2
Abstract:
A semiconductor device according to the present invention includes a semiconductor chip (7), a conductive member (6) for supporting the semiconductor chip, a joint material (27) provided between the conductive member and the semiconductor chip, and a release groove (13) formed on the surface of the conductive member and arranged away from the semiconductor chip with the one end and the other end of the release groove connected to the peripheral edges of the conductive member, respectively.
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Inventors:
Kenji Hayashi
Tetsuhiro Susaki
Tetsuhiro Susaki
Application Number:
JP2014041862A
Publication Date:
November 08, 2017
Filing Date:
March 04, 2014
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L21/52; H01L23/29; H01L25/07; H01L25/18
Domestic Patent References:
| JP2013175551A | ||||
| JP2000252403A | ||||
| JP2005217072A | ||||
| JP2010098153A | ||||
| JP2014079724A | ||||
| JP2009170702A | ||||
| JP2008166626A | ||||
| JP2011216772A | ||||
| JP2013123016A |
Foreign References:
| US5701034 | ||||
| WO2013168796A1 |
Attorney, Agent or Firm:
Inaoka cultivation
Mio Kawasaki
Kyoumura Junji
Mio Kawasaki
Kyoumura Junji