To provide a semiconductor device in which circuit component members are composed of a layer common to a connection conductive layer between a pad electrode and a bump electrode, and the connection conductive layer can be employed for other uses in order to enhance cost performance, and to provide its fabrication process.

On the pad electrode 11 of a semiconductor chip 10 in which an electronic circuit is formed and having the pad electrode 11 on the surface, a connection conductive layer is formed and a bump electrode 18 is formed on the upper layer thereof. A layer common to the connection conductive layer is formed on the semiconductor chip 10 and circuit component members, e.g. a resistive element R, are formed to be connected with the connection conductive layer.