Title:
SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH11162998
Kind Code:
A
Abstract:
To reduce manhour in manufacture and reduce manufacturing cost, in the manufacture of a resin sealing type of semiconductor device.
Resin 5 for bonding which has an opening at the section of a semiconductor element electrode is arranged in the region, where a semiconductor element 2 is made, on a silicon wafer where a plurality of semiconductor elements 2 are made. Here, a lead frame 4 is fixed to a silicon wafer through the resin 5 for bonding, and the semiconductor electrode 3 and the lead frame 4 are connected electrically with each other using a metallic fine wire 6, and after sealing it with potting resin 7, it is cut and divided separately for each semiconductor element 2 using a dicing saw, so as to form a semiconductor device.
Inventors:
YAMAMURA KEN
Application Number:
JP32893697A
Publication Date:
June 18, 1999
Filing Date:
November 28, 1997
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L21/50; H01L21/56; (IPC1-7): H01L21/50; H01L21/56
Attorney, Agent or Firm:
Masuo Oiwa
Previous Patent: SEMICONDUCTOR ELEMENT AND ITS MANUFACTURE
Next Patent: SEMICONDUCTOR DEVICE CUTTING AND ACCOMMODATING DEVICE
Next Patent: SEMICONDUCTOR DEVICE CUTTING AND ACCOMMODATING DEVICE