To enhance a manufacturing yield of a semiconductor device.
This semiconductor device comprises: a rectangular first semiconductor chip and second semiconductor chip stacked in a state that respective one major faces confront each other; a support lead partially disposed between the one major face of the first semiconductor chip and the one major face of the second semiconductor chip; and a resin sealing body for sealing the first semiconductor chip, the second semiconductor chip and the support lead. Each one major face of the first semiconductor chip and the second semiconductor chip is adhered to a part of the support lead via an adhesive layer, and a part of the support lead is formed in a smaller width than each side of the first semiconductor chip and the second semiconductor chip.
IDE TAKUJI
NIIHARA EIJI
FUJIOKA SHUNICHIRO
UENO MITSUE
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