To provide a semiconductor device encapsulated by a sealing material having excellent moldability and productivity, and high heat resistance, adhesion and transparency, and to provide its manufacturing method.
This semiconductor device is encapsulated by the sealing material comprising an addition polymer of a monomer represented by general formula (1) [R1-R4 are each H, a hydrocarbon group having a 1-10C, a specific polar group or a polar hydrocarbon group substituted by the specific polar group, R1-R4 may each be an aromatic or a heterocyclic group or may be linked through an alkylene group having a 1-5C, R1 and R2 or R3 and R4 may be united to form a divalent hydrocarbon group, R1 or R2 may be linked to R3 to R4 together to form a monocyclic or a multicyclic structure, wherein one of R1-R4 is the specific polar group or the polar hydrocarbon group, m and p and each 0 or a positive integer, m+p is 0-4, and the specific polar group is an alkoxyl group, -OH, -COOH, an ester group, -CN, a primary-tertiary amino group, an amide group, an imide group or a group having -SO2and the like].
KASAI KAZUO
OTSUKI TOSHITAKA
