To provide a semiconductor device having the external connection terminal where a void does not exist and to provide a method of manufacturing the device.

In the semiconductor device having the external connection terminal which is electrically connected to an electrode installed on a mounting board and in the method of manufacturing the device, the external connection terminal includes metallic posts 17' which are arranged to project from a terminal installation face where the external connection terminal is arranged and with protection coats 18 protecting surfaces of the posts. The protection coats are set to be solder coats, and openings are formed in forming positions of the posts. A resin film 16 where the openings are filled with metals is thinned. Thus, the posts are constituted of the metals in the openings exposed from the resin film.