Title:
SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD, AND STACK-TYPE SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP3405456
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device that can mixedly mount a semiconductor device with a different function without increasing the area of the semiconductor device, and a method that manufactures the semiconductor device.
SOLUTION: One portion of wiring 104 is formed also at the side of the semiconductor device 101, at the same time, a salient electrode 102 is formed while the side is nearly flush with the wiring 104 formed at the side of the semiconductor device 101, at least one portion of a ball electrode 103 is formed so that it is electrically connected to the wiring 104 at the side of the semiconductor element, the side of the semiconductor device is sealed by resin while the wiring 104 is being exposed, and the opposite surface of a circuit formation surface is sealed by resin.
Inventors:
Nobuhito Ouchi
Yasushi Shiraishi
Yasuo Tanaka
Yasushi Shiraishi
Yasuo Tanaka
Application Number:
JP2000274813A
Publication Date:
May 12, 2003
Filing Date:
September 11, 2000
Export Citation:
Assignee:
Oki Electric Industry Co., Ltd.
International Classes:
H01L23/52; H01L21/301; H01L21/3205; H01L23/12; H01L23/31; H01L23/485; H01L25/065; H01L25/10; H01L25/11; H01L25/18; (IPC1-7): H01L23/12; H01L23/52; H01L25/10; H01L25/11; H01L25/18
Domestic Patent References:
| JP9102576A | ||||
| JP945848A | ||||
| JP8330313A | ||||
| JP888315A | ||||
| JP5326618A |
Attorney, Agent or Firm:
Kamei Miaki (3 others)
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