Title:
半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP7278077
Kind Code:
B2
Abstract:
To provide a semiconductor device that can be improved in durability of securing of an electric conductive member to a semiconductor element.SOLUTION: A semiconductor device comprises a substrate 1, a semiconductor element 3 secured to the substrate 1, a main terminal 6 secured to the semiconductor element 3 using solder 5, and a frame 4 provided at a periphery of the semiconductor element 3 when viewed from a direction perpendicular to the substrate 1, and secured to the substrate 1, and the main terminal 6 is positioned at the frame 4 in a direction perpendicular to the substrate and a direction along the substrate 1.SELECTED DRAWING: Figure 3
Inventors:
Manabu Hotta
Hiroshi Fujimoto
Hiroshi Fujimoto
Application Number:
JP2019002321A
Publication Date:
May 19, 2023
Filing Date:
January 10, 2019
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L21/60
Domestic Patent References:
| JP2015046416A | ||||
| JP2008294338A | ||||
| JP49081866A | ||||
| JP2015041716A | ||||
| JP2008042039A | ||||
| JP2018186244A |
Foreign References:
| WO2018100600A1 | ||||
| WO2012046578A1 |
Attorney, Agent or Firm:
Michiharu Soga
Jun Kajinami
Kazuhiro Oya
Shunichi Ueda
Junichiro Yoshida
Takahiro Matsuoka
Jun Kajinami
Kazuhiro Oya
Shunichi Ueda
Junichiro Yoshida
Takahiro Matsuoka
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