To provide a semiconductor device capable of drastically decreasing, for instance, a material cost of an LED chip material and in configuration of an LED head, easily checking an operation of a pre-assembling state in a mass production of it, preventing a useless cost increase (caused by a waste of the manufacturing time, components, or the like) by preventing a consecutive manufacturing with the use of an operationally defective component, which enhances a quality of the product, and to provide the LED head and a printer using it.
An LED epitaxial film 3 is bonded to an Si substrate 2 having an output-stage-forming region 6 of a driver IC directly or through a metal layer 4. A connection part between an LED light emitting part 11 and the region 6 is connected by a first and a second individual electrodes 5, 7 formed along their surfaces, and a wide width pad part 7b for probing is provided to the second individual electrode 7.
SUZUKI TAKAHITO
CHIHARA SUSUMU
OGIWARA MITSUHIKO
ABIKO ICHIMATSU
SAKUTA MASAAKI
OKI DIGITAL IMAGING KK
Youichi Yamagata