Title:
SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP2536456
Kind Code:
B2
Abstract:
PURPOSE: To enhance a semiconductor device in reliability and yield by a method wherein it is prevented from deteriorating in mounting density and protected against corrosion caused by moisture, and air bubbles are restrained from occurring in sealing resin when resin is poured.
CONSTITUTION: A semiconductor chip is composed of an IC chip 1 connected in a flip-chip connection manner to an electrode pattern formed on a circuit board 2, a first resin which seals up a gap between the circuit board 2 and the IC chip 1, a second resin covers the one primary surface of the circuit board 2 and the IC chip, and a metal cap 6 provided with a through-hole located at its center.
Inventors:
TAGO MASAKI
DOTANI AKIHIRO
DOTANI AKIHIRO
Application Number:
JP14429294A
Publication Date:
September 18, 1996
Filing Date:
June 27, 1994
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L21/60; H01L21/56; H01L23/29; H01L23/31; (IPC1-7): H01L21/56; H01L21/60; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)