Title:
SEMICONDUCTOR DEVICE AND MANUFACTURE OF THE SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH11220077
Kind Code:
A
Abstract:
To enable thinning, and improve coplanarity and reliability.
In order to restrain the warpage of a semiconductor package of overcoating structure, when the thermal expansion coefficient of a wiring board 11 is set to αs, the Young's modulus to Es, the thickness set to Hs, the thermal expansion coefficient of a resin layer 13 to αr, the Young's modulus to Er, and the thickness to Hr, respectively and a value of (αr.Er.Hr)/(αs.Es.Hs) to be at least about 0.6. By adopting such a structure, stresses acting on the semiconductor package can be relieved effectively, and the coplanarity of the semiconductor package can be improved.
Inventors:
NAKAZAWA TAKAHITO
SUGIZAKI YOSHIAKI
SUGIZAKI YOSHIAKI
Application Number:
JP29216498A
Publication Date:
August 10, 1999
Filing Date:
October 14, 1998
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01L23/28; H01L21/56; H01L21/60; H01L23/14; (IPC1-7): H01L23/28; H01L21/56; H01L21/60; H01L23/14
Attorney, Agent or Firm:
Suyama Saichi
Previous Patent: RESIN ENCAPSULATED TYPE SEMICONDUCTOR DEVICE
Next Patent: HEAT DISSIPATION ASSEMBLY AND THERMAL CONDUCTIVITY BODY
Next Patent: HEAT DISSIPATION ASSEMBLY AND THERMAL CONDUCTIVITY BODY