Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
Document Type and Number:
Japanese Patent JP2015230908
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, which allow simultaneous measurement of an overlay accuracy between one element and two elements.SOLUTION: A semiconductor device has an overlay accuracy measurement pattern. The overlay accuracy measurement pattern includes: a first pattern which extends in a first direction and has a first line and a second line which are arranged at a distance from each other in a second direction; a second pattern which extends in the first direction and has a third line and a fourth line which are arranged at a distance from each other in the second direction; and a third pattern which extends in the first direction and has a fifth line and a sixth line which are arranged at a distance from each other in the second direction. A first center position between the first line and the second line in the second direction, a second center position between the third line and the fourth line in the second direction and a third center position between the fifth line and the sixth line in the second direction are located on substantially the same straight line.
Inventors:
FUJISHIRO NAOHIRO
IGUCHI TOMOHIKO
SUGIMURA TAKASHI
IGUCHI TOMOHIKO
SUGIMURA TAKASHI
Application Number:
JP2014114925A
Publication Date:
December 21, 2015
Filing Date:
June 03, 2014
Export Citation:
Assignee:
MICRON TECHNOLOGY INC
International Classes:
H01L21/027; G03F7/20; H01L21/8242; H01L27/108
Attorney, Agent or Firm:
Kato Asamichi
Kiuchi Uchida
Mitsuru Aoki
Kiuchi Uchida
Mitsuru Aoki
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