Title:
半導体装置の製造方法及び半導体装置
Document Type and Number:
Japanese Patent JP7225746
Kind Code:
B2
Abstract:
A semiconductor device includes a semiconductor chip, a substrate having a main surface on which the semiconductor chip is arranged, a resin case which has a storage space therein and a side wall, the side wall having an injection path extending from the storage space to a device exterior, the resin case having a first opening at a bottom side thereof, connecting the storage space to the device exterior, the substrate being disposed on the resin case, at a main surface side of the substrate facing at the bottom side of the resin case, and a sealing material filling the storage space and the injection path.
Inventors:
Yuji Ichimura
Application Number:
JP2018229625A
Publication Date:
February 21, 2023
Filing Date:
December 07, 2018
Export Citation:
Assignee:
Fuji Electric Co., Ltd.
International Classes:
H01L21/56; H01L23/12
Domestic Patent References:
| JP2014082233A | ||||
| JP2017038019A |
Attorney, Agent or Firm:
Patent Attorney Corporation Fuso International Patent Office
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