Title:
半導体装置の製造方法、予兆検知プログラム、及び基板処理装置
Document Type and Number:
Japanese Patent JP7227351
Kind Code:
B2
Abstract:
Provided is technology for executing a process recipe that includes a plurality of steps, and implementing a prescribed process on a substrate, wherein the technology acquires vibration data detected by a vibration sensor among sensor data in a specified step of the steps constituting the process recipe, converts the acquired vibration data to a vibration frequency spectrum, extracts the frequency of a prescribed range of the converted vibration frequency spectrum at prescribed frequency intervals, for each extracted frequency, calculates the average value of the amplitude of the vibration frequency spectrum and the standard deviation using data of a prescribed number of times of the process recipe when normal, creates a normal model using the average value and the standard deviation of the amplitude of the vibration frequency spectrum, compares the amplitude value of the normal model with a predetermined threshold for the extracted frequency amount, and when the amplitude value of a prescribed number or more of frequencies is outside the threshold, assesses that there is an abnormal sign.
Inventors:
Masanori Sakai
Takayuki Kawagishi
Hou Jun
Ichiyoshi Yamamoto
Ryuichi Kaji
Yuuta Tachi
Takayuki Kawagishi
Hou Jun
Ichiyoshi Yamamoto
Ryuichi Kaji
Yuuta Tachi
Application Number:
JP2021506892A
Publication Date:
February 21, 2023
Filing Date:
March 19, 2019
Export Citation:
Assignee:
KOKUSAI ELECTRIC Inc.
International Classes:
H01L21/02; H01L21/31
Domestic Patent References:
| JP2003077780A | ||||
| JP2000259222A |
Attorney, Agent or Firm:
Patent Attorney Corporation Taiyo International Patent Office