Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, CIRCUIT BOARD AS WELL AS ELECTRONIC EQUIPMENT
Document Type and Number:
Japanese Patent JP3736607
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device and a method for manufacturing it, a circuit board as well as an electronic equipment capable of facilitating an electrical connection with high reliability.
SOLUTION: This method for manufacturing a semiconductor device includes a step of forming a through hole 50 at a semiconductor chip 10 having electrodes 14, and forming a conductive layer 70 on a region including the inside of the hole 50. In this case, the hole 50 is formed larger than an opening end at an intermediate part, and the layer 70 is formed by electroless plating.
Inventors:
Kenji Wada
Fumiaki Matsushima
Nobuaki Hashimoto
Kazushige Umezu
Haruki Ito
Teruo Hanaoka
Fumiaki Matsushima
Nobuaki Hashimoto
Kazushige Umezu
Haruki Ito
Teruo Hanaoka
Application Number:
JP2000012670A
Publication Date:
January 18, 2006
Filing Date:
January 21, 2000
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
H01L25/18; H01L21/288; H01L21/768; H01L23/48; H01L25/065; H01L25/07; (IPC1-7): H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP3253025A | ||||
| JP521474A | ||||
| JP6310547A | ||||
| JP10163411A | ||||
| JP60140850A | ||||
| JP63126250A |
Attorney, Agent or Firm:
Inoue Ichi
Yukio Fuse
Mitsue Obuchi
Yukio Fuse
Mitsue Obuchi
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