Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2015005583
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of reducing damage when connecting a bonding wire to a thin power semiconductor element.SOLUTION: The semiconductor device includes: a first metal substrate (1) including semiconductor elements (2a and 2b) one side of which is bonded with conductive material (3a, 3b); and second metal substrates (4a and 4b) which are mounted and bonded to the plane opposite to the plane where the first metal substrate (1) of the semiconductor elements (2a and 2b) is bonded. Metal wires (5a, 5b) are connected to the plane (F) opposite to the plane which is connected to the semiconductor elements (2a and 2b) of the second metal substrates (4a and 4b).
Inventors:
TANAKA JUNYA
Application Number:
JP2013129088A
Publication Date:
January 08, 2015
Filing Date:
June 20, 2013
Export Citation:
Assignee:
PANASONIC CORP
International Classes:
H01L25/07; H01L21/60; H01L25/18
Attorney, Agent or Firm:
Patent business corporation Morimoto international patent firm