Title:
半導体デバイスの製造方法
Document Type and Number:
Japanese Patent JP4510629
Kind Code:
B2
Abstract:
The invention relates to a semiconductor device ( 10 ) comprising a semiconductor element ( 1 ), particularly a solid-state image sensor ( 1 ), comprising a semiconductor body ( 11 ) of which one surface comprises an optically active part ( 1 A) and an optically inactive part ( 1 B) within which electrical connection regions ( 2 ) of the optoelectronic semiconductor element ( 1 ) are present, while a body ( 3 ) is present above the optically active area ( 1 A) of the surface of the semiconductor body ( 11 ) comprising an optical component ( 3 B). According to the invention the body ( 3 ) comprises an optically transparent foil ( 3 ) which is present on the optically active part ( 1 A) of the surface of the semiconductor body ( 11 ) and which is attached thereto with an optically transparent adhesive layer ( 4 ) and in which the optical component ( 3 B) is formed. The device ( 10 ) is very stable, compact and easy to manufacture, that is to say in batches. For example a component ( 3 B) such as a lens ( 3 B) may easily be formed by pressing a suitably formed die ( 13 ) into the foil ( 3 ). A method according to the invention for manufacturing the device according to the invention is cost-effective and easy.
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Inventors:
Anton, P.M.Fan, Allendong
Application Number:
JP2004533717A
Publication Date:
July 28, 2010
Filing Date:
August 11, 2003
Export Citation:
Assignee:
Koninklijke Philips Electronics N.V.
International Classes:
H01L27/14; H01J3/14; H01J5/02; H01L27/146; H01L29/22; H01L33/00; H04N5/225; H04N5/335
Domestic Patent References:
| JP2001238103A | ||||
| JP2002528861A | ||||
| JP61134186A | ||||
| JP2002198502A | ||||
| JP4061277A |
Attorney, Agent or Firm:
Tadahiko Ito
Kenji Yoshitake
Masami Tamama
Hidetoshi Tachibana
Yasukazu Sato
Hiroshi Yoshimoto
Yasushi Kawasaki
Kenji Yoshitake
Masami Tamama
Hidetoshi Tachibana
Yasukazu Sato
Hiroshi Yoshimoto
Yasushi Kawasaki