半導体装置の製造方法 - Sumitomo Bakelite Co., Ltd.

Title:

半導体装置の製造方法

Document Type and Number:

Japanese Patent JP7111129

Kind Code:

B2

Abstract:

Provided is a photosensitive resin composition that comprises a phenol resin (A) having a biphenol structure, a photoacid generator (B), and a solvent.

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Inventors:

Yuma Tanaka

Application Number:

JP2020122881A

Publication Date:

August 02, 2022

Filing Date:

July 17, 2020

Export Citation:

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Assignee:

Sumitomo Bakelite Co., Ltd.

International Classes:

G03F7/023; C08G8/20; G03F7/004; G03F7/075; G03F7/20

Domestic Patent References:

JP2015132676A
JP2008111103A

Foreign References:

WO2013088852A1

Attorney, Agent or Firm:

Sumio Tanai
Masato Iida
Naoshi Fukuhara

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