Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING THEREOF
Document Type and Number:
Japanese Patent JPS5662330
Kind Code:
A
Abstract:
PURPOSE:To improve reliability by preventing occurrence of cracks on pellet, by joining a silver layer, which is formed on the pellet bonding section in a lead frame or a ceramic base, to the pellet, which is provided with lining process, by soldering. CONSTITUTION:A silver plated layer 5 is formed on a tub 2 and an inner lead of a lead frame 1 which is punched out from a sheet of kovar, etc. into a prescribed pattern. A pellet 6 provided with lining process on its tub 2 is joined by soldering 7', and a gold wire 8 is provided between the pellet 6 and the inner lead 3 by nailhead bonding. And then, the pellet 6 and the lead frame 1 are enclosed by resin 9.
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Inventors:
OKIKAWA SUSUMU
SUZUKI HIROMICHI
MIKINO HIROSHI
SUZUKI HIROMICHI
MIKINO HIROSHI
Application Number:
JP13762979A
Publication Date:
May 28, 1981
Filing Date:
October 26, 1979
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/52; H01L23/495; (IPC1-7): H01L21/58
Domestic Patent References:
| JPS5353250A | 1978-05-15 | |||
| JPS52143764A | 1977-11-30 | |||
| JP41016979A | ||||
| JPS5532019A | 1980-03-06 |