To provide a semiconductor device which can be made small-sized, thin and highly functional, a method of manufacturing the same, an electronic component, a circuit board, and an electronic device.
A semiconductor device includes: a semiconductor substrate 10; an external connecting terminal 37 provided to the first surface 10a of the semiconductor substrate 10; a first electrode 22 provided to the first surface 10a of the semiconductor substrate 10 and electrically connected with the external connecting terminal 37; a second electrode 23 electrically connected with an electronic element provided to a second surface 10b facing the first surface 10a of the semiconductor substrate 10; a groove 11 provided to the second surface 10b of the semiconductor substrate 10 and reaching the second electrode 23; and a conductive unit 12 provided inside the groove 11 and electrically connected with the rear side 23a of the second electrode 23.
HASHIMOTO NOBUAKI
| JP2002208655A | 2002-07-26 | |||
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Masatake Shiga
Kazunori Onami
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